Carbice will cover a new heat dissipating technology based on a platform of vertically aligned carbon nanotube arrays, formed into a composite with the nanotubes covalently anchored to aluminum
This presentation will detail the technologies used for providing these capabilities in an injection moldable plastic compound, and explore the challenges in providing a robust EMI shielding and thermal
Electronics today are designed into dynamic and often unpredictable environments. The dynamic thermal behavior of the device influences its functional and lifetime reliability. Failure to properly capture the dynamic
All thermal designs relying on heat sinks and thermal interface materials (TIM) assume uniform and well bonded interfaces for calculating the heat transfer capability of the structure. The reality
The need to further improve cooling and thermal dissipation of electronic devices, transformers and equipment is critical as technological advancements continue. The accurate measurement of the thermal properties of
Boron nitride nanotube (BNNT) consists of boron and nitrogen atoms arranged in a hexagonal network. These light atoms and a symmetrical crystal structure gives rise to molecular fast lattice
Heat can be mitigated, energy can be saved and the performance of automotive systems can be enhanced by the application of phase change material (PCM). PCM possesses the ability
Electronic power modules, such as IGBT or MOSFET based inverters are gaining more importance today as hybrid and electric cars require lighter and more and more reliable traction systems.