Date

May 2, 2019

Location

777 Figueroa Street, Los Angeles, CA 90017

Speakers

Networking and Education

Thermal Materials Summit Overview

The Thermal Materials Summit educates and updates attendees on the latest advancements in thermal interface materials used to mitigate and manage temperature anywhere thermal considerations need to be made.

Topics covered include: Carbon Nantotubes, Boron Nitride Nanotubes, Epoxy Composites, Phase Change Materials, Thermal Tapes, Injection Molded Plastic TIMs, Thermal Modeling, Characterization, Acoustic Microscopy Imaging, and more.

The conference is designed to bring academia and industry together for a day of networking and discussion on new processes and developments in the thermal materials industry. Attendees, speakers, and vendors will include design engineers, academia, materials scientists, CTOs and R&D Managers who develop, design, and use advanced thermal materials.

Attend if you work in these industries: Aerospace, Electronics Packaging, Automotive, Semiconductor/ICs, LED Cooling, Motor Controls, Power Supplies, Discrete Electronic Devices, Telecom and Batteries.

Register Learn More
speaker_audience[1]
UniPhase-3500

WHO SHOULD ATTEND

Professionals Working in These Areas

  • Thermal Interface Materials
  • Thermal Management & Electronics Cooling
  • R&D for Thermal Materials
  • Thermal Design and Modeling
  • Characterization and Measurement for Thermal Materials
  • IC Level Thermal Management

Academia
Researchers, professors and students working towards the goal of advancing thermal interface materials.

Management Executives

– Purchasing
– Design and Products Development
– Sales and Marketing

Industry Consultants and Finance Executives

– Bankers and Private Equity
– Venture Capital Professionals
– Business and Strategy Consultants

Recent News

Henkel Expands Bergquist Gap Pad Portfolio

Henkel Corp. has added two ultra-low modulus Bergquist Gap Pad thermal interface materials (TIMs) to its line of high compliance thermal management products. Bergquist Gap Pad TGP 6000ULM and Bergquist Gap Pad TGP 7000ULM have been formulated with an advanced resin platform

Black Phosphorus Wrinkles Take the Heat

Single atomic sheets of black phosphorus are attracting attention for their potential in future electronics applications. A*STAR researchers have now completed experiments at the nanoscale to unlock the secret of this material’s remarkable directional heat transport properties. Black phosphorus has a layered

Polymer Power Potential with Thermoelectric Materials

The mantra ‘reduce, reuse, recycle’ is increasingly pertinent. Every year, vast amounts of energy that could be captured and reused are lost through waste heat. Now, A*STAR scientists have demonstrated, through theoretical calculations, that it may be possible to fabricate thermoelectric organic

Register now

Early bird pass before March 8th, 2019: $650.    Full Rate Pass After March 8th, 2019: $795.    Onsite Rate Begins May 2nd, 2019: $995

Get Conference Updates Emailed To You…

Submit your email address, and we will keep you informed on program developments, early bird deadlines and other key details.