Henkel Corp. has added two ultra-low modulus Bergquist Gap Pad thermal interface materials (TIMs) to its line of high compliance thermal management products. Bergquist Gap Pad TGP 6000ULM and Bergquist Gap Pad TGP 7000ULM have been formulated with an advanced resin platform
The Thermal Materials Summit educates and updates attendees on the latest advancements in thermal interface materials used to mitigate and manage temperature anywhere thermal considerations need to be made.
Topics covered include: Carbon Nantotubes, Boron Nitride Nanotubes, Epoxy Composites, Phase Change Materials, Thermal Tapes, Injection Molded Plastic TIMs, Thermal Modeling, Characterization, Acoustic Microscopy Imaging, and more.
The conference is designed to bring academia and industry together for a day of networking and discussion on new processes and developments in the thermal materials industry. Attendees, speakers, and vendors will include design engineers, academia, materials scientists, CTOs and R&D Managers who develop, design, and use advanced thermal materials.
Attend if you work in these industries: Aerospace, Electronics Packaging, Automotive, Semiconductor/ICs, LED Cooling, Motor Controls, Power Supplies, Discrete Electronic Devices, Telecom and Batteries.